发明名称 Method of producing electrode for electricity storage device
摘要 A method of producing an electrode for an electricity storage device includes producing a paste to form an electrode active material layer, in which aggregates of a solids fraction material that contains at least an electrode active material and a binder are dispersed in a solvent, coating the paste on a surface of a current collector, and drying the current collector coated with the paste, to form the electrode active material layer formed of the solids fraction material. The paste is produced in such a manner that a content ratio of the solids fraction material in the paste is 60 to 80 mass %, an abundance ratio for the aggregates with a particle size that is equal to or smaller than 20 μm is at least 99%, and a viscosity at 25° C. and a shear rate of 40 s−1 is 200 to 5,000 mPa·s.
申请公布号 US8900653(B2) 申请公布日期 2014.12.02
申请号 US201213615736 申请日期 2012.09.14
申请人 Toyota Jidosha Kabushiki Kaisha 发明人 Mori Junya;Hagiwara Hideki
分类号 B05D5/12;B05D3/04;B05D1/26;H01M4/139;C23C18/12;H01M4/04;H01M4/62;H01M10/0525 主分类号 B05D5/12
代理机构 Finnegan, Henderson, Farabow, Garrett & Dunner, LLP 代理人 Finnegan, Henderson, Farabow, Garrett & Dunner, LLP
主权项 1. A production method for an electrode for an electricity storage device, comprising: producing a paste to form an electrode active material layer, in which aggregates of a solids fraction material that contains at least an electrode active material and a binder are dispersed in a solvent; coating the paste on a surface of a current collector; and drying the current collector coated with the paste, to form the electrode active material layer formed of the solids fraction material, wherein the paste is produced in such a manner that a content ratio of the solids fraction material in the paste is 60 to 80 mass %, an abundance ratio for the aggregates with a particle size that is equal to or smaller than 20 μm is at least 99%, and a viscosity at 25° C. and a shear rate of 40 s−1 is 200 to 5,000 mPa·s.
地址 Toyota-shi, Aichi-ken JP