发明名称 |
Method for fabricating a printed circuit board having differential trace profile |
摘要 |
Circuit boards and methods for their manufacture are disclosed. The circuit boards carry high-speed signals using conductors formed to include lengthwise channels. The channels increase the surface area of the conductors, and therefore enhance the ability of the conductors to carry high-speed signals. In at least some embodiments, a discontinuity also exists between the dielectric constant within the channels and just outside the channels, which is believed to reduce signal loss into the dielectric material. |
申请公布号 |
US8898891(B2) |
申请公布日期 |
2014.12.02 |
申请号 |
US201012961610 |
申请日期 |
2010.12.07 |
申请人 |
Force10 Networks, Inc. |
发明人 |
Goergen Joel R.;Zheng Yi |
分类号 |
H05K3/42;H05K3/46;H05K1/02;H05K1/03 |
主分类号 |
H05K3/42 |
代理机构 |
Haynes and Boone, LLP |
代理人 |
Haynes and Boone, LLP |
主权项 |
1. A method of fabricating a circuit board, the method comprising:
forming, on a dielectric core, a plurality of conductive traces, comprising a subset of the plurality of conductive traces, the subset having conductive traces formed to each contain at least one lengthwise channel; and joining the dielectric core comprising the plurality of conductive traces with a plurality of circuit board layers to form a circuit board, wherein joining the dielectric core with a plurality of circuit board layers to form a circuit board comprises stacking the dielectric core with at least one overlying sheet of uncured resin-impregnated woven fiber dielectric material, and bonding the dielectric core with the at least one overlying sheet under pressure and temperature conditions that cause the resin to fill the lengthwise channels of the subset and a region alongside the conductive traces of the subset. |
地址 |
San Jose CA US |