Method and apparatus for applying fluid during a placement cycle

摘要

Disclosed herein is a method for applying a fluid to a component during a placement cycle. The method includes providing a component placement machine including a housing having a frame attached thereto, the frame having a pick and place head. The method includes providing a fluid application station contiguous with the housing and adapted to apply fluid to the component, moving the housing to a pick location, picking the component from a supply of components using the pick and place head, moving the housing to a location, applying fluid to the picked component, and placing the picked component with the fluid applied onto the printed circuit board at the location. The fluid application step is accomplished during the moving step or placing step. The method may further include repeating the steps for another component where the fluid application step is accomplished during the repeated picking step of the additional component.

主权项

1. A method for applying a fluid to a component during a placement cycle, the method comprising:
(a) providing a component placement machine including a housing, the housing adapted for movement along an X and a Y axis above a printed circuit board, the housing having a frame attached thereto, the frame having a pick and place head disposed thereupon; (b) providing a fluid application station contiguous with the housing and adapted to apply fluid to the component; (c) moving the housing to a pick location; (d) picking the component from a supply of components using the pick and place head; (e) moving the housing to a predetermined location; (f) applying fluid to the picked component; and (g) placing the picked component with the fluid applied onto the printed circuit board at said predetermined location; wherein said fluid application step (f) is accomplished at least substantially during at least one of said moving step (e), and said placing step (g).