发明名称 |
Light emitting device and manufacturing method thereof |
摘要 |
A light emitting device of the invention includes a thin film transistor, an insulating layer covering the thin film transistor, an electrode which is electrically connected to the thin film transistor through a contact hole formed on the insulating layer, and a light emitting element formed by interposing a light emitting layer between a first electrode which is electrically connected to the electrode and a second electrode. The light emitting device further includes a layer formed of a different material from that of the insulating layer only between the electrode and the first electrode over the insulating layer and the insulating layer. |
申请公布号 |
US8901809(B2) |
申请公布日期 |
2014.12.02 |
申请号 |
US201113253099 |
申请日期 |
2011.10.05 |
申请人 |
Semiconductor Energy Laboratory Co., Ltd. |
发明人 |
Sakakura Masayuki;Takahashi Shuhei;Ikeda Kazuko;Futamura Tomoya |
分类号 |
G09G3/30;H05B33/04;H01L27/32;H01L27/12 |
主分类号 |
G09G3/30 |
代理机构 |
Robinson Intellectual Property Law Office, P.C. |
代理人 |
Robinson Eric J.;Robinson Intellectual Property Law Office, P.C. |
主权项 |
1. A light emitting device comprising:
a pixel portion comprising a light emitting element and a first transistor; a first wiring electrically connected to one of a source electrode and a drain electrode of the first transistor; a first protective circuit comprising a first diode and a second diode wherein the first diode and the second diode are electrically connected to the first wiring; a second wiring electrically connected to a gate electrode of the first transistor; a second protective circuit comprising a third diode and a fourth diode wherein the third diode and the fourth diode are electrically connected to the second wiring. |
地址 |
Atsugi-shi, Kanagawa-ken JP |