Tuning the efficiency in the transmission of radio-frequency signals using micro-bumps

摘要

A device includes a die including a main circuit and a first pad coupled to the main circuit. A work piece including a second pad is bonded to the die. A first plurality of micro-bumps is electrically coupled in series between the first and the second pads. Each of the plurality of micro-bumps includes a first end joining the die and a second end joining the work piece. A micro-bump is bonded to the die and the work piece. The second pad is electrically coupled to the micro-bump.

主权项

1. A device comprising:
a die comprising a main circuit, and a first pad coupled to the main circuit; a work piece bonded to the die, wherein the work pieces comprises a second pad; a first micro-bump joining the die and the work piece, wherein the first micro-bump is electrically coupled between the first and the second pads; and a first dummy micro-bump adjacent the first micro-bump, wherein the first dummy micro-bump physically joins the work piece and the die, and is electrically disconnected from features inside the work piece, and wherein the first dummy micro-bump is electrically grounded through connections in the die.