Monolithic Power Converter Package with Through Substrate vias

摘要

According to an exemplary embodiment, a monolithic power converter package includes a monolithic die over a substrate, the monolithic die integrating a driver integrated circuit (IC) with a control power transistor and a sync power transistor connected in a half-bridge. The high side power input and a power output of the half-bridge each are disposed on a top surface of the monolithic die. The high side power input is electrically coupled to the substrate through a high side power connection. The power output is electrically coupled to the substrate through a power output connection. The low side power input of the half-bridge comprises a plurality of through substrate vias that extend through the monolithic die to electrically connect a low side power pad to the monolithic die.

主权项

1. A monolithic power converter package comprising:
a monolithic die over a substrate, said monolithic die integrating a driver integrated circuit (IC) with a control power transistor and a sync power transistor connected in a half-bridge; a high side power input and a power output of said half-bridge each being disposed on a top surface of said monolithic die;said high side power input being electrically coupled to said substrate through a high side power connection;
said power output being electrically coupled to said substrate through a power output connection; a low side power input of said half-bridge comprising a plurality of through substrate vias that extend through said monolithic die to electrically connect a low side power pad to said monolithic die; said monolithic power converter package thereby achieving low resistive and inductive connections for said monolithic die, without using a bond wire for connection to said low side power input.