Method of forming an overmolded dual in-line memory module cooling structure

摘要

Methods, apparatuses, and computer program products for forming an overmolded dual in-line memory module (DIMM) cooling structure are provided. Embodiments include identifying, by a tagging module, contextual information indicating circumstances in which the photograph was taken; based on the contextual information, selecting, by the tagging module, candidate profiles from a plurality of friend profiles associated with a profile of a user; and suggesting, by the tagging module to the user, the selected candidate profiles as potential friends to tag in the photograph.

主权项

1. A method of forming an overmolded dual in-line memory module (DIMM) cooling structure, the method comprising:
providing, by a molding system, a mold for a DIMM, the DIMM including a portion with attached memory chips; and forming, by the molding system, a thermal interface that includes thermal material, the thermal material surrounding at least the portion of the DIMM with the attached memory chips, the thermal interface to transfer heat from the DIMM to a cooling manifold, wherein the cooling manifold is a liquid pipe.