发明名称 Gate-all-around nanowire MOSFET and method of formation
摘要 A method for fabricating a semiconductor device comprises forming a nanowire on an insulator layer at a surface of a substrate; forming a dummy gate over a portion of the nanowire and a portion of the insulator layer; forming recesses in the insulator layer on opposing sides of the dummy gate; forming spacers on opposing sides of the dummy gate; forming source regions and drain regions in the recesses in the insulator layer on opposing sides of the dummy gate; depositing an interlayer dielectric on the source regions and the drain regions; removing the dummy gate to form a trench; removing the insulator layer under the nanowire such that a width of the trench underneath the nanowire is equal to or less than a distance between the spacers; and forming a replacement gate in the trench.
申请公布号 US8900951(B1) 申请公布日期 2014.12.02
申请号 US201314035060 申请日期 2013.09.24
申请人 International Business Machines Corporation 发明人 Cheng Kangguo;Doris Bruce B.;Hashemi Pouya;Khakifirooz Ali;Reznicek Alexander
分类号 H01L21/336;H01L29/06;H01L29/66 主分类号 H01L21/336
代理机构 Harrington & Smith 代理人 Harrington & Smith ;Percello Louis J.
主权项 1. A method for fabricating a semiconductor device, comprising: forming a nanowire on an insulator layer at a surface of a substrate; forming a dummy gate over a portion of the nanowire and a portion of the insulator layer; forming recesses in the insulator layer on opposing sides of the dummy gate; forming spacers on opposing sides of the dummy gate; forming source regions and drain regions in the recesses in the insulator layer on opposing sides of the dummy gate; depositing an interlayer dielectric on the source regions and the drain regions; removing the dummy gate to form a trench; removing the insulator layer under the nanowire such that a width of the trench underneath the nanowire is equal to or less than a distance between the spacers; and forming a replacement gate in the trench.
地址 Armonk NY US