发明名称 Circuit testing device and method for implementing same
摘要 A device for testing a circuit made up of a printed circuit board on which components, preferably dummy components, are assembled by the solder connections. An enclosure of the testing device subjects the circuit under test to a schedule of thermo-mechanical and/or vibration constraints. Bridges of electrical resistors, forms a hardware portion of the testing device. A software portion of the testing device sets a detection criterion representing damage to one or more solder connections and displays the results of the test. An input/output interface converts each electrical resistor measurement of the tested chains of solder connections into data for use the software portion. An adjusting component modifies the criterion for detecting damage to the solder connections.
申请公布号 US8901952(B2) 申请公布日期 2014.12.02
申请号 US200913140418 申请日期 2009.12.15
申请人 European Aeronautics Defence and Space Company Eads France 发明人 Moreau Katell;Grieu Marc
分类号 G01R31/28;G01R31/04 主分类号 G01R31/28
代理机构 IM IP Law PLLC 代理人 IM IP Law PLLC ;Im C. Andrew
主权项 1. A device for testing a circuit comprising a printed circuit board on which electronic components are assembled by means of solder connections, comprising a climatic enclosure for subjecting the circuit under test to a schedule of thermo-mechanical or vibration stresses; a hardware component comprising bridges of electrical resistors to measure an overall electrical resistance of multiple solder connections of the circuit under test that are electrically interconnected, each one to the next; a computer system for performing in situ analysis of the measurement provided by the hardware component and further comprising: a software component executed by the computer system sets a detection criterion representing damage to one or more solder connections that make up the assembly of electronic components on the printed circuit board for a test;a display for displaying the results of the test;an input/output interface for converting each electrical resistor measurement of chains of solder connections tested into data for use by the software component; andwherein the software component is operable to modify the detection criterion for detecting damage to the soldered connections.
地址 Paris FR