发明名称 Blanket short channel roll-up implant with non-angled long channel compensating implant through patterned opening
摘要 A method that forms a structure implants a well implant into a substrate, patterns a mask on the substrate (to have at least one opening that exposes a channel region of the substrate) and forms a conformal dielectric layer on the mask and to line the opening. The conformal dielectric layer covers the channel region of the substrate. The method also forms a conformal gate metal layer on the conformal dielectric layer, implants a compensating implant through the conformal gate metal layer and the conformal dielectric layer into the channel region of the substrate, and forms a gate conductor on the conformal gate metal layer. Additionally, the method removes the mask to leave a gate stack on the substrate, forms sidewall spacers on the gate stack, and then forms source/drain regions in the substrate partially below the sidewall spacers.
申请公布号 US8900954(B2) 申请公布日期 2014.12.02
申请号 US201113289051 申请日期 2011.11.04
申请人 International Business Machines Corporation 发明人 Adkisson James W.;Anderson Brent A.;Bryant Andres;Nowak Edward J.
分类号 H01L29/772;H01L21/336;H01L21/28;H01L29/66;H01L29/10;H01L21/265 主分类号 H01L29/772
代理机构 Gibb & Riley, LLC 代理人 Gibb & Riley, LLC ;LeStrange, Esq. Michael J.
主权项 1. A method comprising: implanting a well implant into a substrate such that said well implant extends laterally between shallow trench isolation regions and is shallower in depth than said shallow trench isolation regions; patterning a mask on said substrate above said well implant, said mask having an opening that exposes a channel region of said substrate; forming a conformal dielectric layer on said mask and to line said opening, said conformal dielectric layer covering said channel region of said substrate; forming a conformal gate metal layer on said conformal dielectric layer; implanting a compensating implant through said conformal gate metal layer and said conformal dielectric layer into said well implant in said channel region of said substrate, said compensating implant extending vertically through said well implant to a lower portion of said substrate below said well implant; forming a gate conductor in said opening on said conformal gate metal layer; removing said mask to leave a gate stack on said substrate; forming sidewall spacers on said gate stack; and forming source/drain regions in said substrate, extending laterally from said shallow trench isolation regions to partially below said sidewall spacers, and extending vertically through said well implant into said lower portion of said substrate below said well implant, said source/drain regions being separated from said compensating implant by portions of said well implant and said portions of said well implant being partially below said gate stack.
地址 Armonk NY US