Litho cluster and modulization to enhance productivity

摘要

The present disclosure relates to a lithographic tool arrangement for semiconductor workpiece processing. The lithographic tool arrangement groups lithographic tools into clusters, and selectively transfers a semiconductor workpiece between a plurality of lithographic tools of a first type in a first cluster to a plurality of lithographic tools of a second type in a second cluster. The selective transfer is achieved though a transfer assembly, which is coupled to a defect scan tool that identifies defects generated in the lithographic tool of the first type. The disclosed lithographic tool arrangement also utilizes shared structural elements such as a housing assembly, and shared functional elements such as gases and chemicals. The lithographic tool arrangement may consist of baking, coating, exposure, and development units configured to provide a modularization of these various components in order to optimize throughput and efficiency for a given lithographic fabrication process.

主权项

1. A lithographic tool arrangement for semiconductor workpiece processing, comprising:
a first cluster tool comprising a plurality of lithographic tools of a first type; a second cluster tool comprising a plurality of lithographic tools of a second type, wherein the second type is different from the first type; a first common delivery apparatus for the first cluster tool configured to deliver chemical materials to the lithographic tools within the first cluster tool; a second common delivery apparatus for the second cluster tool configured to deliver chemical materials to the lithographic tools within the second cluster tool; and a first transfer assembly configured to move a semiconductor workpiece from any one of the plurality of lithographic tools of the first type to any one of the plurality of lithographic tools of the second type.