发明名称 |
Stable nanoparticles for electroless plating |
摘要 |
Stable tin-free palladium catalysts are used to metalize through-holes of printed circuit boards. A stabilizer is included in the catalyst formulation which prevents precipitation and agglomeration of the palladium. |
申请公布号 |
US8900666(B2) |
申请公布日期 |
2014.12.02 |
申请号 |
US201113278865 |
申请日期 |
2011.10.21 |
申请人 |
Rohm and Haas Electronic Materials LLC |
发明人 |
Liu Feng;Rzeznik Maria Anna |
分类号 |
B05D3/04;B05D3/10;C25D5/02;H05K3/00;C23C18/28 |
主分类号 |
B05D3/04 |
代理机构 |
|
代理人 |
Piskorski John J. |
主权项 |
1. A method comprising:
a) providing a substrate with a plurality of through-holes; b) applying a conditioner comprising one or more cationic surfactants to the through-holes; c) applying a composition comprising glutathione and palladium to the through-holes; and d) depositing a metal on walls of the through-holes with an electroless metal bath. |
地址 |
Marlborough MA US |