发明名称 Stable nanoparticles for electroless plating
摘要 Stable tin-free palladium catalysts are used to metalize through-holes of printed circuit boards. A stabilizer is included in the catalyst formulation which prevents precipitation and agglomeration of the palladium.
申请公布号 US8900666(B2) 申请公布日期 2014.12.02
申请号 US201113278865 申请日期 2011.10.21
申请人 Rohm and Haas Electronic Materials LLC 发明人 Liu Feng;Rzeznik Maria Anna
分类号 B05D3/04;B05D3/10;C25D5/02;H05K3/00;C23C18/28 主分类号 B05D3/04
代理机构 代理人 Piskorski John J.
主权项 1. A method comprising: a) providing a substrate with a plurality of through-holes; b) applying a conditioner comprising one or more cationic surfactants to the through-holes; c) applying a composition comprising glutathione and palladium to the through-holes; and d) depositing a metal on walls of the through-holes with an electroless metal bath.
地址 Marlborough MA US