Multiple layered head interconnect structure

摘要

A multiple layered interconnect structure to provide an electrical interface between one or more electrical elements on a head to read/write circuitry is disclosed. The interconnect structure includes first and second interconnecting layers. The first interconnecting layer is formed on a slider body of the head and includes a first or lower bond pad connectable to one or more electrical elements on the slider body through the first interconnecting layer. The second interconnecting layer includes a second or upper bond pad connectable to the one or more transducer elements through the second interconnecting layer. The second interconnecting layer is on top of the first interconnecting layer and the structure includes an insulating layer between the first and second interconnecting layers. In illustrated embodiments, the first and second interconnecting layers are formed on a back side or surface of the slider body to form top side upper and lower bond pads that interface with bond pads on a flex circuit to provide the interface to R/W circuitry.

主权项

1. A head comprising:
a slider body; a first bond pad over the slider body coupled to a first conductive trace over the slider body; a second bond pad over the slider body spaced from the first bond pad and coupled to a second conductive trace above the first conductive trace; and an insulating layer between the first and second conductive traces insulating the second trace from the first trace, wherein the first bond pad and the first conductive trace are a part of an interconnect layer comprising a plurality of conductive pads connected by conductive strips, with one of the plurality of conductive pads forming the first bond pad, and wherein the plurality of conductive pads and the conductive strips are in substantially a same plane.