Alignment for backside illumination sensor

摘要

Provided is an apparatus that includes an integrated circuit located in a first region of a substrate having first and second opposing major surfaces and an alignment mark located in a second region of the substrate and extending through the substrate between the first and second surfaces.

主权项

1. A method comprising:
providing a substrate having a first region and second region, wherein the first region includes an integrated circuit; forming a recess in the second region of the substrate; forming a material within the recess in the second region of the substrate; forming another material within the recess, the another material being different than the material within the recess; and removing a portion of the substrate to expose a portion of the material, wherein the exposed material is an alignment mark.