发明名称 HIGH FREQUENCY MODULE
摘要 <p>The present invention relates to a high frequency module having an electromagnetic wave shield function. According to an embodiment of the present invention, the high frequency module may include: a main board which has an upper surface on which at least one electronic component is mounted and a main ground electrode; a sub board bonded to the edge of the lower surface of the main board; a molding part which seals the electronic component mounted on the upper surface of the main board; and an electromagnetic wave shield part formed on the side of the main board and the surface of the molding part. The sub board protrudes from the main board with a preset length to be bonded. The sub board has a sub ground electrode which has the preset length on the opposite surface of the main board. The sub ground electrode can be electrically connected to the electromagnetic wave shield part.</p>
申请公布号 KR20140136743(A) 申请公布日期 2014.12.01
申请号 KR20130057207 申请日期 2013.05.21
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 SONG, HYUN JEONG
分类号 H01L23/60;H05K9/00 主分类号 H01L23/60
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