发明名称 DEVICE FOR TESTING A PACKAGE AND METHOD THE SAME
摘要 <p>The present invention relates to a package inspection device and a package inspection method. The package inspection device according to an embodiment of the present invention comprises: a test package provision unit for providing a test package; a setting unit for setting package inspection conditions; a test performing unit for performing a test on the test package under the set package inspection conditions; a reflow unit for performing reflow in the test package in which the test is performed; and a defect detection unit for detecting defects of the test package.</p>
申请公布号 KR20140136583(A) 申请公布日期 2014.12.01
申请号 KR20130056469 申请日期 2013.05.20
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 LEE, HYUN JUNG;LIM, JI HYUK
分类号 G01R31/26;H01L21/66 主分类号 G01R31/26
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