| 摘要 |
<p>The present invention relates to a direct panel bonding method which can suppress generation of minute air bubbles during direct bonding of a touch screen panel and a window panel of an LCD module, thereby minimizing a failure rate and improving a yield. In particular, according to the direct panel bonding method, it is possible to reduce manufacturing costs by forming a discharge path for the air bubble using a simple printing method such as screen printing. The direct panel boding method of the present invention comprises the following: an adhesive layer formation step of forming an adhesive layer by applying a resin on the top surface of a first panel, and forming a plurality of air bubble discharge paths which crosses the top surface of the first panel and opens toward edges of the first panel; and a bonding step of stacking a second panel on the adhesive layer and pressurizing the same to be bonded to the first panel, wherein minute air bubbles generated between the first panel and the second panel are introduced to the air bubble discharge paths and discharged toward the edges and some of the resin forming the adhesive layer fills the air bubble discharge paths for bonding.</p> |
