ELECTROLYTIC PLATING APPARATUS

摘要

The present invention relates to an electrolytic plating apparatus and, more specifically, to an electrolytic plating apparatus to allow uniform plating on a wafer to be plated. The present invention may comprise: a plating bath for storing an electrolytic plating solution therein; an anode and a cathode dipped inside the electrolytic plating solution, and having a plating solution ejecting hole; a plating solution outlet installed inside the plating bath to supply and circulate the electrolytic plating solution; and an auxiliary panel installed closely with the anode and the cathode and formed with a plating solution passing hole to be linked with the plating solution ejecting hole of the anode and the cathode.