| 发明名称 |
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD |
| 摘要 |
<p>A PHOTOSENSITIVE RESIN COMPOSITION COMPRISING (A) A BINDER POLYMER, (B) A PHOTOPOLYMERIZING COMPOUND HAVING AN ETHYLENIC UNSATURATED BOND IN THE MOLECULE, (C) A PHOTOPOLYMERIZATION INITIATOR AND (D) A POLYMERIZATION INHIBITOR, WHEREIN THE CONTENT OF THE (D) POLYMERIZATION INHIBITOR IS 20-100 PPM BY MASS BASED ON THE TOTAL SOLID CONTENT OF THE COMPOSITION.</p> |
| 申请公布号 |
MY152732(A) |
申请公布日期 |
2014.11.28 |
| 申请号 |
MY2010PI04973 |
申请日期 |
2009.04.24 |
| 申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
AJIOKA, YOSHIKI;ISHI, MITSURU;ISO, JUNICHI |
| 分类号 |
G03F7/00 |
主分类号 |
G03F7/00 |
| 代理机构 |
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