| 摘要 |
<p>The present invention relates to a semiconductor module. A semiconductor module according to an embodiment of the present invention can include: a substrate on which a semiconductor device is mounted, a heat radiation member formed on one side of the substrate, a housing which is formed on the other side and is combined with the substrate. The housing is extended from an inner wall facing the substrate, and a pressure member which is formed in one end of the body and pressurizes the other side of the substrate.</p> |
