| 摘要 |
<p>The present invention relates to an inverter device and, more particularly, to an inverter device capable of improving heat dissipation by embedding a capacitor unit in a heat sink module and improving assembly properties and durability by reducing a support stand and a combination structure. The inverter device according to an embodiment of the present invention includes the heat sink module, the capacitor part which is received in the heat sink module, a middle base which is combined with the upper side of the heat sink module, a capacitor part circuit board which is surface-combined with the middle base, a power module which is received in a part of the middle base, a power circuit board which is combined with the upper side of the power module, and a top case which is combined with the middle base and covers and receives the power module, the power circuit board, and a terminal part.</p> |
