WAFER CLEANING APPARATUS AND METHOD

摘要

The present invention relates to a wafer cleaning apparatus and method. The wafer cleaning apparatus comprises a porous chuck attached to a dicing frame, to which a wafer is attached, and mounted in the dicing frame; a cup which is located on the porous chuck and the dicing frame and surrounds the wafer; a fixing unit which is formed on one side of the cup and fixes the cup to the porous chuck; a lifting unit which is powered when the fixing unit is powered and lifts the cup; and a cleaning solution jetting unit which is located on the top of the porous chuck and jets a cleaning solution for cleaning the wafer when the wafer is surrounded by the cup. The wafer cleaning apparatus can completely remove adhesive materials used during a wafer manufacturing process from the wafer as well as prevent damage to the wafer when the adhesive materials are removed.