METHOD FOR PRODUCING THIN SEMICONDUCTOR COMPONENTS

摘要

A semiconductor substrate (1) is provided with a structure (3) on an upper side (2), and an additional substrate (4) provided for handling the semiconductor substrate is likewise structured on an upper side (5). The structuring of the additional substrate takes place in at least partial correspondence with the structure of the semiconductor substrate. The structured upper sides of the semiconductor substrate and the additional substrate are positioned such that they face one another and are permanently connected to one another. Subsequently, the semiconductor substrate is thinned from the rear side (6), and the additional substrate is removed at least to such a degree that the structure of the semiconductor substrate is exposed to the extent required for the further use.

主权项

1. A method for producing thin semiconductor devices, comprising:
providing a semiconductor substrate with a structure featuring a terminal pad on an upper side of the semiconductor substrate, providing an additional substrate for handling the semiconductor substrate, the additional substrate being structured on an upper side to a maximum depth and in at least partial correspondence with the structure of the semiconductor substrate, without penetrating the additional substrate, the upper side of the additional substrate being flat in a region of the terminal pad, the upper sides of the semiconductor substrate and the additional substrate being permanently connected to one another, the semiconductor substrate being thinned from a rear side facing away from the upper side, a contact hole to the terminal pad being produced from the rear side after the thinning of the semiconductor substrate, and a through-substrate via being produced in the contact hole and connected to the terminal pad without filling the contact hole, and the additional substrate being removed at least to such a degree that the structure is exposed, a remaining portion of the additional substrate being maintained on the side of the terminal pad that faces away from the through-substrate via and mechanically stabilizing the terminal pad.