ENCAPSULATION FILM AND METHOD FOR ENCAPSULATING ORGANIC ELECTRONIC DEVICE USING SAME

摘要

The present application relates to an encapsulation film, an organic electronic device encapsulation product, and a method for encapsulating an organic electronic device. The present application provides the encapsulation film for effectively blocking moisture or oxygen introduced into the organic electronic device from the outside, increasing the life and the durability of the organic electronic device and thereby contributing to high reliability, and minimizzing an align error in a step of adhering a film to a substrate.