| 摘要 |
PROBLEM TO BE SOLVED: To provide an evaluation device and a wafer evaluation method, which evaluate a fracture strength of a semiconductor wafer and identify a defective part of the semiconductor wafer.SOLUTION: In a semiconductor wafer evaluation system having a fracture device which fractures a semiconductor wafer by applying a load to the semiconductor wafer and a microscope for monitoring a fracture surface of the semiconductor wafer, the fracture device includes a support jig for supporting the semiconductor wafer on which one groove is processed in a diameter direction and loading means for applying a load in a direction along the groove of the semiconductor wafer supported by the support jig, in which by monitoring the fracture surface of the semiconductor wafer by the microscope after fracturing the semiconductor wafer by applying a load by the loading means from a surface of the semiconductor wafer on the side opposite to the surface where the groove is processed and in a direction along the groove, a fracture strength of the semiconductor wafer is measured and a defective part of the semiconductor wafer is specified thereby to enable evaluation of the semiconductor wafer. |
