| 摘要 |
A heat dissipation plate including a heat-conductive material layer, a first metal layer, a metal substrate, and a metal ring frame is provided. The heat-conductive material layer has an upper surface and a lower surface opposite to each other. A material of the heat-conductive material layer includes ceramic or silicon germanium. The first metal layer is disposed on the lower surface of the heat-conductive material layer and has a first rough surface structure. The metal substrate is disposed below the first metal layer and has a second rough surface structure. The metal ring frame is disposed between the first metal layer and the metal substrate. The first rough surface structure, the metal ring frame, and the second rough surface structure define a fluid chamber, and a working fluid flows in the fluid chamber. |
| 主权项 |
1. A heat dissipation plate comprising:
a heat-conductive material layer having an upper surface and a lower surface opposite to each other, wherein a material of the heat-conductive material layer comprises ceramic or silicon germanium; a first metal layer disposed on the lower surface of the heat-conductive material layer and having a first rough surface structure; a metal substrate disposed below the first metal layer and having a second rough surface structure; and a metal ring frame disposed between the first metal layer and the metal substrate, wherein the first rough surface structure, the metal ring frame, and the second rough surface structure define a fluid chamber, and a working fluid flows in the fluid chamber. |
