METHOD FOR MANUFACTURING OF MULTILAYER SUPER-DENSE POPULATED PRINTED CIRCUIT BOARD

摘要

FIELD: electricity.SUBSTANCE: invention may be used for designing and manufacturing of multilayer printed circuit boards intended for superdense wiring connections of surface mount electronic components, including matrix arrangement of outputs with pitch less than 0.8 mm (including BGA and CGA).EFFECT: provision of reliable electric connection in case of a multilayer printed circuit with superdense wiring connections by forming transfers to underlying layers directly from bonding pads, where reliability is ensured by transient plated-through holes filled with prepreg compound having the corresponding temperature expansion coefficient, reduction of weight and dimensions, increase in density of wire connections arrangement and decrease in labour intensity while forming electric interconnections for highly integrated electronics in rocket and space equipment.2 dwg