| 摘要 |
PROBLEM TO BE SOLVED: To provide a fluorescent X-ray analyzer capable of determining whether or not difference between the whole composition and surface composition of a Sn-Ag solder bump formed on a substrate is within an allowable range.SOLUTION: A fluorescent x-ray analyzer for radiating primary X-rays 2 from an X-ray source 1 to a sample 3 where a Sn-Ag solder bump 3b is formed on a substrate 3a and measuring the intensity of generated fluorescent X-rays 4 by detection means 9, comprises: quantification means 10 for obtaining a whole concentration that is Ag concentration in the whole solder bump 3b on the basis of a ratio between the intensity of the Ag-Kα line and the intensity of the Sn-Kα line measured by the detection means 9, and for obtaining a surface concentration that is Ag concentration in the surface of the solder bump 3b on the basis of a ratio between the intensity of the Ag-Lα line and the intensity of the Sn-Lα line measured by the detection means 9; and segregation evaluation means 11 for evaluating segregation in the solder bump 3b on the basis of whether or not difference between the whole concentration and the surface concentration is equal to or below a predetermined value. |
