发明名称 METAL-CERAMIC SUBSTRATE AND METHOD FOR PRODUCING SUCH A METAL-CERAMIC SUBSTRATE
摘要 A metal-ceramic substrate and to a method for the production thereof. The metal-ceramic substrate having at least one ceramic layer (2), which is provided on a first surface side (2a) with at least one first metallization (3) and on a second surface side (2b), opposite from the first surface side (2a), with a second metallization (4), wherein the first metallization (3) is formed by a film or layer of copper or a copper alloy and is connected to the first surface side (2a) of the ceramic layer (2) with the aid of a “direct copper bonding” process. The second metallization (4) is formed by a layer of aluminum or an aluminum alloy.
申请公布号 US2014345914(A1) 申请公布日期 2014.11.27
申请号 US201314350661 申请日期 2013.02.13
申请人 Curamik Electronics GmbH 发明人 Meyer Andreas;Wehe Christoph;Schulz-Harder Jürgen;Schmidt Karsten
分类号 H05K1/02;H05K3/38;C04B37/00 主分类号 H05K1/02
代理机构 代理人
主权项
地址 Eschenbach DE