| 摘要 |
A hot melt adhesive for use on porous substrates, wherein the hot melt adhesive has a) about 10% to about 70%> by weight of a polypropylene homopolymer having a DSC melting point of less than 100°C; b) about 10% to about 60% of a first tackifying resin having a Ring & Ball Softening Point of about 95°C to about 140°C; c) about 0% to about 65% of a second tackifying resin that is different than the first tackifying resin; d) about 5% to about 50%> of a plasticizer; e) about 1% to about 40% by weight of a secondary polymer which is either a semi- crystalline polymer or wax with an enthalpy of fusion of greater than 30 Joules/gram; f) about 0.1% to about 5% of a stabilizer or antioxidant; wherein the components total 100% by weight of the composition, and the viscosity of the composition is equal to or less than about 20,000 centipoise (cP) at 163°C (325°F). |
