| 发明名称 |
PRINTED CIRCUIT BOARD FILM |
| 摘要 |
A film of a printed circuit board (PCB) (5) includes a top film (1) with a first solder mask spot (11) and a bottom film (2) with a second solder mask spot (21). When the top film (1) and the bottom film (2) are placed on a top layer and a bottom layer of the PCB (5) respectively, concentric circles are formed by the first solder mask spot (11), a hole (8) defined on the PCB (5), and the second solder mask spot (21). A diameter of the first solder mask spot (11), a diameter the second solder mask spot (21), and a diameter of the hole (5) represent a plugged depth of the hole (8). |
| 申请公布号 |
US2014345520(A1) |
申请公布日期 |
2014.11.27 |
| 申请号 |
US201414288353 |
申请日期 |
2014.05.27 |
| 申请人 |
HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD. ;HON HAI PRECISION INDUSTRY CO., LTD. |
发明人 |
LIN SZE-YU;LUO HUI |
| 分类号 |
H05K3/34 |
主分类号 |
H05K3/34 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A film of a printed circuit board (PCB) (5), comprising a top film (1) with a first solder mask spot (11) and a bottom film (2) with a second solder mask spot (21), wherein when the top film (1) and the bottom film (2) are placed on a top surface and a bottom surface of the PCB (5) respectively, concentric circles are formed by the first solder mask spot (11), and a hole (8) defined in the PCB and the second solder mask spot (21), a diameter of the first solder mask spot (11), a diameter of the second solder mask spot (21), and a diameter of the hole (8), represent a plugged depth of the hole (8). |
| 地址 |
Shenzhen CN |
