发明名称 INJECTION MOLD APPARATUS
摘要 <p>The present invention relates to an injection molding apparatus capable of reducing a die cooling time. The injection molding apparatus comprises: a storage tank which stores cooling mediums; an injection mold equipped with at least one cooling channel wherein the cooling medium circulates a first path which supplies the cooling medium of the storage tank to a cooling channel; a second path which collects the cooling medium of the cooling channel; an air inject unit arranged in order to spray compressed air of high pressure on the cooling channel by being installed in the first path; and a first valve arranged in order to control the flow control of the cooling medium receiving air of high pressure. The first valve is characterized by guiding the cooling medium to at least one path among a third path connecting the first path, and the cooling channel and a fourth path connecting the second path and the cooling channel.</p>
申请公布号 KR20140135860(A) 申请公布日期 2014.11.27
申请号 KR20130055539 申请日期 2013.05.16
申请人 SAMSUNG ELECTRONICS CO., LTD.;CHUNG WATER MADE. CO., LTD. 发明人 KIM, YOUNG MIN;MOON, MYUNG CHUL;YU, KI CHEOL;LEE, DONG HEE;KANG, MYEONG HEON;KIM, A SUNG
分类号 B29C45/73;B29C33/04 主分类号 B29C45/73
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