| 摘要 |
<p>A semiconductor manufacturing apparatus according to an embodiment comprises: a reaction chamber; a wafer carrier arranged inside the reaction chamber; a wafer which is arranged on the wafer carrier and includes a center area, an intermediate area, and an edge area; and first and second supply units which are located on the top of the wafer carrier and jet reaction gas in a wafer direction. The first supply unit includes multiple first exhaust parts for exhausting the reaction gas. The first exhaust part includes a center exhaust part which exhausts the reaction gas to the center area of the wafer; an intermediate exhaust part which exhausts the reaction gas to the intermediate area of the wafer; and an edge exhaust part which exhausts the reaction gas to the edge area of the wafer.</p> |
