| 摘要 |
The invention relates to a ribbon, preferably a bonding ribbon for bonding in microelectronics, comprising a first layer comprising copper with a surface and at least a coating layer superimposed over the surface of the first layer, wherein the coating layer comprises aluminium, and an intermediate layer, wherein in a cross-sectional view of the ribbon the area share of the first layer is in the range of from 50 to 96 %, based on the total area of the cross-section of the ribbon, wherein the aspect ratio between the width and the height of the ribbon in a cross-sectional view is in the range of from 0.03 to less than 0.8, wherein the ribbon has a cross-sectional area in the range of from 25'000 µm 2 to 800'000 µm 2 , wherein the intermediate layer is arranged between the first layer and the coating layer, wherein the intermediate layer comprises at least one intermetallic phase comprising material of the first layer and material of the coating layer. The invention further relates to a process for making a wire, to a wire obtainable by said process, to an electric device comprising at least two elements and at least aforementioned wire, to a propelled device comprising said electric device and to a process of connecting two elements through aforementioned wire by wedge-bonding. |
