METHOD FOR MANUFACTURING SUBSTRATE FOR POWER MODULE, METHOD FOR MANUFACTURING SUBSTRATE FOR POWER MODULE WITH HEAT SINK, AND METHOD FOR MANUFACTURING POWER MODULE

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a substrate for power module capable of manufacturing a substrate for a highly-reliable power module capable of facilitating heat dissipation from a heating element such as an electronic component mounted on a circuit layer or the like and suppressing occurrence of cracking of an insulation substrate during cooling/heating cycle load, and having excellent power cycle characteristics.SOLUTION: A circuit layer is composed of oxygen-free copper or 6 -Cu. A metal layer is composed of aluminum or an aluminum alloy. Thickness tof the circuit layer is within the range of 0.1 mm≤t≤0.6 mm. Thickness tof the metal layer is within the range of 0.5 mm≤t≤6 mm. The relationship between the thickness tof the circuit layer and the thickness tof the metal layer is t/t≥4.0. A method for manufacturing a substrate for a power module comprises: a step S101 of bonding a copper plate serving as a circuit layer and an insulation substrate using a DBC method or an active brazing filler metal (copper plate bonding step); and a step S102 of bonding an aluminum plate serving as a metal layer and an insulation substrate using an Al-Si-based brazing filler metal foil (aluminum plate bonding step).