STACKED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING STACKED MICROELECTRONIC DEVICES

摘要

Stacked microelectronic devices and methods of manufacturing stacked microelectronic devices are disclosed herein. In one embodiment, a method of manufacturing a microelectronic device includes forming a plurality of electrically isolated, multi-tiered metal spacers on a front side of a first microelectronic die, and attaching a back-side surface of a second microelectronic die to individual metal spacers. In another embodiment, the method of manufacturing the microelectronic device may further include forming top-tier spacer elements on front-side wire bonds of the first die.

主权项

1. A method of manufacturing a microelectronic device, the method comprising:
forming a plurality of multi-tiered metal spacers having first spacer elements on a front-side surface of a first microelectronic die and second spacer elements on corresponding first spacer elements; attaching a back-side surface of a second microelectronic die to the second spacer elements; and wherein at least one of the first and second spacer elements is electrically isolated from at least one of the front-side surface of the first die and the back-side surface of the second die.