| 主权项 |
1. A multilevel leadframe for an integrated circuit package, the leadframe comprising:
a plurality of lead lines formed in a first level of the multilevel leadframe, each lead line having a line width and being separated from an adjacent lead line by at least a lead line clearance distance, wherein each of the plurality of lead lines have a contact region at a first end of the lead line and bond pad at the second end of the lead line; a first plurality of bond pads formed in a second level of the multilevel leadframe arranged in a first row and being separated from an adjacent bond pad by a bond pad clearance distance, each bond pad having a pad width, wherein the pad width is greater than the line width; a second plurality of bond pads arranged in a second row, wherein each bond pad of the second plurality of bond pads is connected to one of the plurality second ends of the lead lines on the first level, wherein the lead lines connected to the second plurality of bond pads is routed between adjacent lead lines connected to the first plurality of bond pads in the first row, wherein the pad width is greater than its respective line width; each lead line has a width that may be determined by design rules for current capacity requirements, and transmission line properties; and bond pads in the first row and second rows are spaced apart by one clearance distance rather than allowing for a lead line and two clearance distances. |
