| 摘要 |
For the lower molding plate (8), a molding plate having a lower plate body (10) configured from an electrically conductive material and a lower embedded electrode (12) embedded in the lower plate body (10) is used. The lower embedded electrode (12) is electrically insulated from the lower plate body (10) by an insulator (14) and is embedded so that a portion thereof is exposed on the surface of the lower plate body (10) that contacts the lower board base sheet (16). |
