HEAT DISSIPATION DEVICE FOR MOVING-COIL LOUDSPEAKER

摘要

A heat dissipation device for a moving-coil loudspeaker, comprising: a thermally conductive pad, a thermally conductive bar, and a heat sink, the thermally conductive pad, the thermally conductive bar and the heat sink being integrally mounted at an axially central portion of the loudspeaker; the thermally conductive bar is axially connected to the thermally conductive pad and the heat sink at top and bottom thereof respectively, the thermally conductive bar is axially provided with a through hole or a groove at a circle center thereof, the heat sink is axially provided with a through hole in which a screw is tapped, a central groove at a top end of the thermally conductive bar is aligned with a groove on the thermally conductive pad to form a straight line groove such that a communication passage leading to an exterior of the loudspeaker is for the electronic components on a circuit board.

主权项

1. A heat dissipation device for a moving-coil loudspeaker, comprising: a thermally conductive pad, a thermally conductive bar, and a heat sink, wherein the thermally conductive pad, the thermally conductive bar and the heat sink are mounted at an axially central portion of the moving-coil loudspeaker; wherein:
the thermally conductive bar is axially connected to the thermally conductive pad and the heat sink at top and bottom thereof respectively, the thermally conductive bar is axially provided with a through hole or a groove at a circle center thereof, the heat sink is axially provided with a through hole in which a screw is tapped, an upper-end plane of the thermally conductive pad is provided with a circuit board formed of electronic components, a central groove at a top end of the thermally conductive bar is aligned with a groove on the thermally conductive pad to form a straight line groove such that a communication passage leading to an exterior of the moving-coil loudspeaker is provided for the electronic components on the circuit board.