| 摘要 |
PROBLEM TO BE SOLVED: To provide a mold release film which is used in a heating press when a circuit board is produced and can exhibit both of embeddability to a circuit exposure film and mold releasability after used in the heating press.SOLUTION: The mold release film 10 has a cushion layer 20 and a mold release layer 1. The cushion layer has a first resin layer 2 and a second resin layer 3. The Vicat softening point X (°C) of the first resin layer is made different from that Y (°C) of the second resin layer. As a result, when the mold release film is used in the heating press to produce a circuit board, the mold release film can exhibit both of embeddability to a circuit exposure film and mold releasability after used in the heating press. |
