| 摘要 |
The present application relates to an encapsulation film, an organic electronic device encapsulation product, and a method for encapsulating an organic electronic device. The present application provides the encapsulation film for effectively blocking moisture or oxygen introduced into the organic electronic device from the outside, preventing adhesion damage and organic film damage due to volume expansion, which occurs when a moisture adsorbing agent reacts with moisture, and increasing the life and the durability of the organic electronic device, thereby contributing to high reliability. |
