| 摘要 |
An inverter (300) is provided on the opening side of a motor-side metal housing (201), a power module (301) is disposed on a metal cover (207) in contact with the metal housing (201), said power module being provided with a semiconductor element, a metal terminal connected to the semiconductor element, and a resin that seals the semiconductor element and the metal terminal, and a metal plate (306) is provided on a power module (301) surface on the reverse side of the metal cover (207). Heat generated by the power module (301) is dissipated from both the metal cover (207) and the metal plate (306). Consequently, heat dissipation performance of the power conversion apparatus is improved, and the size of the power module is reduced. |
