| 摘要 |
<p>A method for manufacturing a semiconductor device, said method having the following steps: step A, in which a laminate comprising an electronic component mounted on a mounting body is prepared; step B, in which a laminated sheet comprising a sealing sheet and a functional layer is prepared, said sealing sheet being for sealing the electronic component and said functional layer comprising a material that is different from the material constituting the sealing sheet; step C, in which the laminate is placed on top of a heating plate with the surface of the laminate on which the electronic component is mounted facing up and the laminated sheet is placed on top of the surface of the laminate on which the electronic component is mounted with the sealing-sheet side of the laminated sheet facing down; and step D, in which, after step C, hot pressing is used to embed and seal the electronic component in the sealing sheet. After step D, at least parts of the edges of the functional layer are covered by a resin that constitutes the sealing sheet.</p> |
