发明名称 |
LIGHT EMITTING ELEMENT PACKAGE AND MANUFACTURING METHOD OF THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a light emitting element package which improves the luminous efficiency, and to provide a manufacturing method of the light emitting element package.SOLUTION: A light emitting element package 10 includes: a substrate 1 including multiple protrusions; an insulation layer 2 located on the substrate 1; a metal layer 3 located on the insulation layer 2; and a light emitting element 4 which is installed on the substrate 1 and is electrically connected with the metal layer 3. |
申请公布号 |
JP2014222771(A) |
申请公布日期 |
2014.11.27 |
申请号 |
JP20140154033 |
申请日期 |
2014.07.29 |
申请人 |
LG INNOTEK CO LTD |
发明人 |
CHO BUM CHUL;PARK JIN SOO |
分类号 |
H01L33/60;H01L33/44;H01L33/46;H01L33/48 |
主分类号 |
H01L33/60 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|