发明名称 LIGHT EMITTING ELEMENT PACKAGE AND MANUFACTURING METHOD OF THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a light emitting element package which improves the luminous efficiency, and to provide a manufacturing method of the light emitting element package.SOLUTION: A light emitting element package 10 includes: a substrate 1 including multiple protrusions; an insulation layer 2 located on the substrate 1; a metal layer 3 located on the insulation layer 2; and a light emitting element 4 which is installed on the substrate 1 and is electrically connected with the metal layer 3.
申请公布号 JP2014222771(A) 申请公布日期 2014.11.27
申请号 JP20140154033 申请日期 2014.07.29
申请人 LG INNOTEK CO LTD 发明人 CHO BUM CHUL;PARK JIN SOO
分类号 H01L33/60;H01L33/44;H01L33/46;H01L33/48 主分类号 H01L33/60
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