发明名称 MULTILAYER CERAMIC ELECTRONIC COMPONENT AND BOARD FOR MOUNTING THE SAME
摘要 <p>PROBLEM TO BE SOLVED: To provide a multilayer ceramic electronic component and a board for mounting the same, which have excellent reliability and high capacitance.SOLUTION: The multilayer ceramic electronic component includes: a hexahedral ceramic body including dielectric layers and satisfying T/W>1.0 when L, W and T respectively denote its length, width and thickness; first and second internal electrodes stacked to face one another, with the dielectric layers interposed therebetween, within the ceramic body; and insulating layers formed on both lateral surfaces of the ceramic body and having a thickness less than or equal to that of the ceramic body. When Wb denotes the sum of the width of the ceramic body and widths of the insulating layers, 0.90≤W/Wb≤0.97 is satisfied.</p>
申请公布号 JP2014222749(A) 申请公布日期 2014.11.27
申请号 JP20130163082 申请日期 2013.08.06
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 KIM JUN-HOON;KIM BYUNG SOO;ONO MASAAKI
分类号 H01G4/12;H01G2/06;H01G4/232;H01G4/30 主分类号 H01G4/12
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