发明名称 |
METHODS OF FORMING CHARGE STORAGE STRUCTURES INCLUDING ETCHING DIFFUSED REGIONS TO FORM RECESSES |
摘要 |
Methods are disclosed that include selectively etching diffused regions to form recesses in semiconductor material, and forming charge storage structures in the recesses. Additional embodiments are disclosed. |
申请公布号 |
US2014349454(A1) |
申请公布日期 |
2014.11.27 |
申请号 |
US201414456337 |
申请日期 |
2014.08.11 |
申请人 |
Micron Technology, Inc. |
发明人 |
Schrinsky Alex;Khandekar Anish;Aella Pavan;Rana Niraj B. |
分类号 |
H01L27/115 |
主分类号 |
H01L27/115 |
代理机构 |
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代理人 |
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主权项 |
1. A method of forming a memory string, comprising:
forming a stack of alternating layers of semiconductor material and dielectric material; forming an opening within the stack; diffusing a dopant into the semiconductor material exposed to the opening to form a plurality of diffused regions, each of the diffused regions extending a distance into the semiconductor material from a sidewall of the opening; selectively etching the diffused regions to form recesses in the semiconductor material, wherein etching substantially stops at each interface between the semiconductor material and the diffused regions; forming charge storage structures within the recesses; and forming a channel region within the opening. |
地址 |
Boise ID US |