| 发明名称 |
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME |
| 摘要 |
A semiconductor device includes a plurality of parallel conductive lines that are spaced apart from one another in a first direction and extend in a second direction transverse to the first direction. The parallel conductive lines includes first and second lines that are adjacent, and a third line that is adjacent to the second line, and the first and third lines each have a cut portion at different points along the second direction. |
| 申请公布号 |
US2014346677(A1) |
申请公布日期 |
2014.11.27 |
| 申请号 |
US201414194433 |
申请日期 |
2014.02.28 |
| 申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
SONODA Masahisa |
| 分类号 |
H01L23/498;H01L21/768 |
主分类号 |
H01L23/498 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor device comprising:
a wiring pattern that includes a plurality of parallel conductive lines that are spaced apart from one another in a first direction and extend in a second direction transverse to the first direction, wherein the parallel conductive lines includes first and second lines that are adjacent, and a third line that is adjacent to the second line, and the first and third lines each have a cut portion at different points along the second direction. |
| 地址 |
Tokyo JP |
