| 发明名称 |
SURFACE MOUNTABLE ELECTRONIC COMPONENT |
| 摘要 |
A surface mountable electronic component free of connecting wires comprises a semiconductor substrate, wherein a plurality of solderable connection areas are arranged at the underside of the component. The component comprises at least one recess is formed in the region of the edges bounding the underside; and in that the recess is covered with an insulating layer. A method for the manufacture of such a component comprises the formation of corresponding recesses. |
| 申请公布号 |
US2014346642(A1) |
申请公布日期 |
2014.11.27 |
| 申请号 |
US201214342999 |
申请日期 |
2012.09.06 |
| 申请人 |
VISHAY SEMICONDUCTOR GMBH |
发明人 |
Mähner Claus |
| 分类号 |
H01L21/78;H01L23/00;H01L23/544 |
主分类号 |
H01L21/78 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A surface mountable electronic component free of connecting wires having a semiconductor substrate, wherein a plurality of solderable connection areas are arranged at the an underside of the component,
wherein at least one recess is formed in a region of the edges bounding the underside; and wherein the recess is covered with an insulating layer. |
| 地址 |
Heilbronn DE |
