发明名称 SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
摘要 A semiconductor device includes an interlayer insulating film on a substrate, the interlayer insulating film including first and second trenches, a gate insulating film in the first and second trenches, a first conductivity type work function control film on the gate insulating film in the first trench, a second conductivity type work function control film on the gate insulating film in the second trench, a first gate metal on the first conductivity type work function control film, the first gate metal filling the first trench, a second gate metal on the gate insulating film in the second trench, and a carrier mobility improving film on the second conductivity type work function control film, the carrier mobility improving film filling the second trench.
申请公布号 US2014346617(A1) 申请公布日期 2014.11.27
申请号 US201414228806 申请日期 2014.03.28
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM Jong-Pil;YEOH Yun-Young
分类号 H01L29/78;H01L29/66 主分类号 H01L29/78
代理机构 代理人
主权项 1. A semiconductor device, comprising: an interlayer insulating film on a substrate, the interlayer insulating film including first and second trenches; a gate insulating film in the first and second trenches; a first conductivity type work function control film on the gate insulating film in the first trench; a second conductivity type work function control film on the gate insulating film in the second trench; a first gate metal on the first conductivity type work function control film, the first gate metal filling the first trench; a second gate metal on the gate insulating film in the second trench; and a carrier mobility improving film on the second conductivity type work function control film, the carrier mobility improving film filling the second trench.
地址 Suwon-si KR