发明名称 SEMICONDUCTOR DEVICES INCLUDING PROTRUDING INSULATION PORTIONS BETWEEN ACTIVE FINS
摘要 A semiconductor device can include a field insulation layer including a planar major surface extending in first and second orthogonal directions and a protruding portion that protrudes a particular distance from the major surface relative to the first and second orthogonal directions. First and second multi-channel active fins can extend on the field insulation layer, and can be separated from one another by the protruding portion. A conductive layer can extend from an uppermost surface of the protruding portion to cross over the protruding portion between the first and second multi-channel active fins.
申请公布号 US2014346602(A1) 申请公布日期 2014.11.27
申请号 US201414458955 申请日期 2014.08.13
申请人 Maeda Shigenobu;Kang Hee-Soo;Sim Sang-Pil;Hong Soo-Hun 发明人 Maeda Shigenobu;Kang Hee-Soo;Sim Sang-Pil;Hong Soo-Hun
分类号 H01L29/78;H01L27/12;H01L29/06 主分类号 H01L29/78
代理机构 代理人
主权项 1. A semiconductor device comprising: a field insulation layer including a first region having a planar major surface extending in first and second orthogonal directions and a second region vertically disposed on the major surface, a top surface of the second region having a particular distance from the major surface; first and second multi-channel active fins extending on the field insulation layer, the first and second multi-channel active fins separated by the second region of the field insulation layer which extends orthogonally with respect to the first and second multi-channel active fins; a first gate disposed on the first multi-channel active fin and a second gate disposed on the second multi-channel active fin; and a first epitaxial source/drain region disposed between the second region of the field insulation layer and the first gate, and a second epitaxial source/drain region disposed between the second region of the field insulation layer and the second gate.
地址 Seongnam-si KR